BUSINESS AREA
As a M&A Due diligence supporter,
If you have the advanced packaging materials and high-tech equipment technologies, please Suggest your leading- edge technology to us so that we can find out your company’s value proposition
● Technical, strategy, Market due diligence to support M&A
● Advanced packaging material M&A
● Technology transfer, Technical cooperation
● Establishing the oversea plant
If you have the advanced packaging materials and high-tech equipment technologies, please Suggest your leading- edge technology to us so that we can find out your company’s value proposition
● Technical, strategy, Market due diligence to support M&A
● Advanced packaging material M&A
● Technology transfer, Technical cooperation
● Establishing the oversea plant
We can make sales easy for you so that you can save your time and money
● Finding out who you should sell to
● Making sure you sell to decision makers
● Bring you qualified leads
● Increasing your stagnant market share %
● Finding out who you should sell to
● Making sure you sell to decision makers
● Bring you qualified leads
● Increasing your stagnant market share %
We can support you with special wafer and packaging service
● Wafer service
● Wafer service
● HBM bump wafer (2.5D/3D)
● bump wafer with big die size (40*40mm)
● bump wafer with big die size (40*40mm)
● PCB (Substrate)
● Wafer matched PCB (Substrate)
● Wafer matched PCB (Substrate)
● X*Y*Z (mm)
240 * 46.5 * 0.5T mm
240 * 77.5 * 0.5T mm
240 * 95 * 0.5T mm
● Packaging service
● Wafer backgrinding (Thickness 80um ~ )
Wafer dicing, Die attach, Wire bonding,
Flip chip bonding, Molding, Singulation
● Advanced package/Flip chip/Ceramic package etc.
● Packaging service
● Wafer backgrinding (Thickness 80um ~ )
Wafer dicing, Die attach, Wire bonding,
Flip chip bonding, Molding, Singulation
● Advanced package/Flip chip/Ceramic package etc.