As a M&A Due diligence supporter, 
If you have the advanced packaging materials and high-tech equipment technologies, please Suggest your leading- edge technology to us so that we can find out your company’s value proposition

●   Technical, strategy, Market due diligence to support M&A
●   Advanced packaging material M&A
●   Technology transfer, Technical cooperation
●   Establishing the oversea plant 

We can make sales easy for you so that you can save your time and money

●   Finding out who you should sell to
●   Making sure you sell to decision makers
●   Bring you qualified leads
●   Increasing your stagnant market share %

We can support you with special wafer and packaging service

●   Wafer service
      ●   HBM2 bump wafer (2.5D/3D)
      ●   Customized bump wafer
   ‌
●   Packaging service
       ●   Wafer backgrinding (Thickness 80um ~  )
            Wafer dicing, Die attach, Wire bonding,
            Flip chip bonding, Molding, Singulation
        ●   Ceramic/Plastic/Flip chip package
       ●   Advanced packages